High-Temperature UHF RFID Label 48×14mm | UCODE 9
The ForNext 48×14mm High-Temperature PI UHF RFID Label is engineered for industrial environments where standard RFID labels cannot withstand heat, chemicals or thermal cycling.
Built on a polyimide (PI) substrate with an aluminium-etched antenna, and powered by the high-performance NXP UCODE 9 chip, this label maintains stable RF performance through demanding processes such as reflow soldering, oven curing, automotive painting, powder coating and high-temperature logistics.
The PI base material offers exceptional heat resistance, dimensional stability and mechanical durability.
This construction enables the label to survive continuous operating temperatures up to +150°C, as well as repeated heating and cooling cycles without antenna deformation or performance loss.
The EPC Class 1 Gen2 / ISO 18000-6C compliant UCODE 9 IC provides fast reading, excellent sensitivity and a 96-bit EPC memory optimised for high-volume industrial operations.
With 100,000 programming cycles and 10 years data retention, the tag is designed for long-life traceability, work-in-progress tracking and manufacturing process control.
Supplied on rolls for automated application, the 48×14mm format balances compact size with strong RF output, making it suitable for PCB tracking, asset identification and high-temperature production flows.
ESD protection up to 2 kV HBM ensures compatibility with electronics manufacturing environments where static control is critical.
The label is ideally suited for OEMs, EMS providers, automotive plants and industrial users who require a durable, heat-proof, globally compliant RFID solution.
Key Features
- High-temperature PI substrate — survives processes up to +150°C
- 48×14mm format — balanced size for automated line application
- Aluminium-etched antenna for stable, high-sensitivity UHF performance
- Powered by NXP UCODE 9 with 96-bit EPC and excellent RF sensitivity
- Global UHF band — 860–960 MHz (Gen2 / ISO 18000-6C)
- 10-year data retention and 100,000 programming cycles
- ESD-resistant design — 2 kV HBM
- Compatible with reflow, curing, baking, painting and other thermal processes
- Available on rolls for automatic label application
- Custom logos, printing and encoding available
Specifications
| Dimensions | 48 × 14 mm |
| Substrate | PI (Polyimide) |
| Antenna Material | Aluminium Etching |
| Chip / IC | NXP UCODE 9 |
| Protocol | EPC Class 1 Gen2; ISO/IEC 18000-6C |
| Frequency | 860–960 MHz (Global) |
| EPC Memory | 96 bits |
| User Memory | 0 bits |
| TID | 48 bits (read-only) |
| IC Life | 100,000 programming cycles; 10-year data retention |
| Operating Temperature | –25°C to +150°C, 20–80% RH (non-condensing) |
| Storage Temperature | –25°C to +150°C (in sealed ESD packaging) |
| ESD Protection | 2 kV HBM (Max. 2000 V) |
| Operating Mode | Passive UHF |
| Packaging | 2,500 pcs per roll |
| Customisation | Printing, logo, encoding, sequential EPC |
This 48×14mm high-temperature PI RFID label is ideal for PCB assembly lines, reflow ovens, automotive painting, curing processes, industrial manufacturing, electronics WIP tracking and any environment requiring a heat-resistant UHF label.
